新系列包括具有8毫米爬电距离和电气间隙以及具有0.4毫米隔离层、可加强隔离的产品

 

2016年8月29日

 

东京—东芝公司（TOKYO：6502）旗下存储与电子元器件解决方案公司今日宣布推出行业领先的[1]高速通信光电耦合器，实现高达50Mbps的数据速率。两款新产品“TLP2767”和“TLP2367”出货即日启动。
 

“TLP2767”是业界[1]首款50Mbps产品，实现8毫米的爬电距离和电气间隙以及可加强隔离的0.4毫米隔离层。产品采用SO6L封装，可保证5000Vrms（最小值）的隔离电压。“TLP2367”采用5引脚小型SO6封装，可保证5毫米（最小值）的爬电距离和电气间隙以及3750Vrms的隔离电压。两款产品均为2.3毫米（最大值）低高度封装，满足包括UL1577和EN60747-5-5在内的国际安全标准。
 

新的光电耦合器可保证20ns（最大值）的传输延迟时间、8ns（最大值）的脉宽失真和10ns（最大值）的传输延迟偏差。这些产品可用于减少各种接口（包括逆变器）的停滞时间，有助于提升系统的功率效率。其在输入端融合了东芝原创的高输出红外线LED，使阈值输入电流较东芝现有产品[2]降低约20%。在输出端，采用CMOS工艺制造的光电探测器集成电路（IC），使其电源电流较东芝现有产品[2]降低约50%，有助于降低功耗和系统成本。另外，该系列产品有助于降低系统的工作电压，同时保证2.7V-5.5V的电源电压，能够在最高达125摄氏度的温度下工作。应用领域包括可编程逻辑控制器（PLC）、I/O接口、光伏（PV）逆变器和FA逆变器。

注
[1]在光电耦合器产品类别中，截至2016年8月29日。东芝调查。
[2]东芝现有产品：TLP117（MFSOP6封装）。

有关新产品和东芝高速通信光电耦合器的更多信息，请访问如下链接：
http://toshiba.semicon-storage.com/ap-en/product/opto/photocoupler/ic-highspeed.html?mm=cp160906&no=01

Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.

Toshiba Corporation- Semiconductor and Storage Products Company　Website＞
http://toshiba.semicon-storage.com/cn/?mm=cp160906&no=02

 

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Companies Website:
http://toshiba.semicon-storage.com/cn/?mm=cp160906&no=02

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