DF1-3P-2.5DS(05) Hirose Electric Wire-to-wire connector - 商品詳細情報
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DF1-3P-2.5DS(05)
DF1-3P-2.5DS(05)
Conn Wire to Board HDR 3 POS 2.5mm Solder RA Thru-Hole Bag
HTSN : 8536694040
Search Alternative Products
Conn Wire to Board HDR 3 POS 2.5mm Solder RA Thru-Hole Bag
HTSN : 8536694040
Data Sheet | |
---|---|
Datasheet | EN_Hirose Electric_Datasheet_20240308222855529 |
Specifications
- Manufacturer name
- Hirose Electric
- Product name
- DF1-3P-2.5DS(05)
- Product classification
- Wire-to-wire connector
- Lifecycle Status
- LTB
- RoHS
- RoHS
- Pitch
- 2.5mm
- Series name
- DF1
- Product type
- Wire to Board
- Shape/Type
- Header
- Number of arrays
- 1
- Rated current
- 3A
- Contact point finish
- Tin
- Contact resistance
- 30mΩ以下/100mA
- Height
- 6mm
- Housing material
- ポリアミド樹脂/UL94V-0/薄茶色
- Insulation resistance
- 1000MΩ以上/500VDC
- Length
- 10mm
- Material of terminal
- 黄銅
- Maximum service temperature
- 85C
- Minimum service temperature
- -30C
- Other names
- H126004 | 541-0021-7-05 | 5494-DF1-3P-2.5DS(05) | DF1-3P-2.5DS(05)-ND
- Rated Voltage(AC)
- 250VAC
- Rated Voltage(DC)
- 250V
- Width
- 10.5mm
- Wire connection method
- Solder
- Withstanding Voltage
- 250VAC/1min.
- Connector Type
- Header
- Contact Finish Thickness
- 1um
- Contact Material
- Brass
- Contact Type
- Male Pin
- Fastening Type
- Friction Lock
- Insulation Material
- Polyamide(PA)/Nylon
- Material Flammability Rating
- UL94 V-0
- Mounting Type
- Standard on-Board
- Number of Positions Loaded
- All
- Number of poles
- 3
- Number of positions
- 3
- Operating temperature range
- -30 to 85C
- Plating
- Tin
- Terminal shape
- Solder
- Manufacturer Packaging
- Pack
- Manufacturer packaging quantity
- 100
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Details
* Documents
1. Catalogue
2. 2D model
3. 3D [IGES] model
4. 3D [STEP] model