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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2025/06/01 PCN(Product Change Notice) Supplier Notice No.:HPLM-2024-0019
Title:
Supplier addition of Cu-wire for LQFP products in RH850/F1, R1 and D1 Series

Description of Change:
Renesas will add a Cu-wire supplier for LQFP products in RH850/F1, R1 and D1 Series as follows:
Item / Before Change / After Change
Cu-wire: Supplier Addition / Supplier A / Supplier A and Supplier B

Reason for Change:
For stable product supply by adding Cu-wire suppliers.

Impact on Fit, Form, Function, Quality & Reliability:
The change will have no impact on the form, fit, function, quality and reliability of the devices.

Effective Date:
6/1/2025
2025/06/01 PCN(Product Change Notice) Supplier Notice No.:HPLM-2024-0040
Title:
Supplier addition of Cu-wire for LQFP products in RH850/F1, R1 and D1 Series

Description of Change:
Renesas will add a Cu-wire supplier for LQFP products in RH850/F1, R1 and D1 Series as follows:
Item / Before Change / After Change
Cu-wire: Supplier Addition / Supplier A / Supplier A and Supplier B

Applicable Assembly Factory
Renesas Electronics Corporation Nishiki Factory
Renesas Semiconductor (Suzhou) Co., Ltd.

Reason for Change:
For stable product supply by adding Cu-wire suppliers.

Impact on Fit, Form, Function, Quality & Reliability:
The change will have no impact on the form, fit, function, quality and reliability of the devices.

Effective Date:
6/1/2025
2025/09/01 PCN(Product Change Notice) Renesas plans to add the production sites for RH850/F1KM-S1 Series.
2025/09/01 PCN(Product Change Notice) Supplier Notice No.:HPLM-2025-0083
Title:
Addition of production sites and material changes for RH850/F1KM-S1 Series

Description of Change:
Renesas plans to add the following production sites for RH850/F1KM-S1 Series.
1.Wafer Process (WP) and Wafer Test (WT): Naka Factory
For both Suzhou Factory and Nishiki Factory,φ20umCu-wire and mold resin for φ20um Cu-wire will
be used for Assembly Process of products whose Wafer Process is produced at Naka (There are no
material changes in ATJ-Kumamoto).
2.Back Grind (BG) and Dicing (DIC): Oita Factory
3.Assembly and Final Test (FT): Nishiki Factory

Reason for Change:
For the stable supply of products.

Impact on Fit, Form, Function, Quality & Reliability:
The change will have no impact on the form, fit, function, quality and reliability of the devices.

Effective Date:
9/1/2025
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PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

Product & Sales Information of products subject to notification

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Products: 427 out of cases/Show 1 to 25