PCN/PDN/NRND Information MCIMX6S6AVM08AC｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2020/12/16	PCN(Product Change Notice)	NXP Will Add a Sealed Date to the Product Label * Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same. PP0000724692/93/94/95/96/98
2021/05/28	PCN(Product Change Notice)	NXP Final Test Site Relocation Initiative: ATTJ to ATTJ Building 2 (ATTJ-B2) - Phase 2 Qualification Results
2023/05/27	PCN(Product Change Notice)	Linux Kernel GPLv2 License Breach Introduced in Q4’2022 Linux Factory Release LF 5.15.71_2.2.0 has been distributed to customers Remarks NXP has released two patches on Feb 9th 2023 on NXP’s GitHub repository “nxp-imx/linux-imx” to fix the problem. These patches will roll back the license to “GPL v2.0 only” for all affected source files and make them compliant with Linux kernel licensing scheme. The patches also remove author’s email ID from the code comments. The following are the patches accessible by customers on GitHub to remedy the problem. 1. LF-8313-1: Update License to GPL-2.0 2. LF-8313-2: Update License to GPL-2.0 Customers using EVKs for evaluation can download the new images/binaries from the following link and continue to their evaluation. https://www.nxp.com/design/software/embedded-software/i-mx-software/embedded-linux-for-i-mx-applications-processors:IMXLINUX
2025/01/01	PCN(Product Change Notice)	This material change will take place for substrates manufactured by Nanya and ASE supplier.
2025/01/01	PCN(Product Change Notice)	Supplier Notice No.:202409013F01 Title: i.MX6 SoloLite, i.MX6 SoloX, i.MX6 Solo, i.MX6 DualLite Automotive product Qualification of Material Changes in Substrate and Solder Ball at N Reason: Qualification of Material Changes in Substrate and Solder Ball is required for manufacturing flexibility and customer supply assurance. Identification of Affected Products: Product identification does not change Effective Date: Jan 01, 2025
2025/05/26	PCN(Product Change Notice)	Supplier Notice No.:202504007I Title:Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products(3/7) Description: Previously, NXP Semiconductors announced with General Notification 202502001G (16-Feb-2025) the Freescale logo to NXP logo product marking conversion for all former Freescale products not previously converted. Now, for customer convenience, NXP Semiconductors provides a follow-up series of Customer Information Notifications (CINs) to relay to customers their impacted products. Note that due to the extensive product list, your organization may indeed receive multiple CIN notifications to encompass your impacted products. Reason: This NXP marking initiative achieves unified NXP branding for the entire portfolio. Customer Information Notification to relay to customers their impacted products. Anticipated Impact on Form, Fit, Function, Reliability or Quality : No Impact on form, fit, function, reliability or quality
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PCN/PDN/NRND Information

Notification Type

Notification Information

Notification Date

Products subject to notification

Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

Product & Sales Information of products subject to notification

Shopping Guide

Products in stock are shipped any time after payment is completed.
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Inventory Information ▼

: JP:Japan, HK:Hong Kong, US:United States
EU:Europe, AUS:Australia, Asia:Asia, NA:North America

Supplier Information ▼

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: Stocks of semiconductor sourced from authorized distributors

Product Information ▼

MOQ/SPQ

MOQ：: Minimum purchase quantity that can be ordered.
Please enter a number greater than the MOQ when ordering.

SPQ：: Number of units that can be ordered.
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Reel Processing
It is a service that connects empty tape to both ends of a tape cut using a special tool, set the reel, and rewind it into the packaged form for delivery. It is made so that it can be set as is to a mounting machine. Processing is available from 100 pieces or more.
PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.

Package type▼: Bulk:
Bulk is a package which the separete parts are packed in a bag, or packed individually.
Tape & Reel:
Tape & Reel is the unmodified original reel received from the manufacturer.
In case the MOQ is smaller than the manufacturer's standard package quantity, it will be cut tapes even if the package is shown as "Tape & Reel".
Cut tape:
Cut tape is a tape cut from an original reel. Cut tape does not contain a leader or trailer.
If you require a one continuous cut tape, please put your comment on your remarks.
For our supplier's stock, we are unable to ensure that the package will be one continuous cut tape even if you put your remark.

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Product Information ▼

: New Products released by manufacturers within 1 year

: New Products on Chip One Stop website within 3 months

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PCN/PDN/NRND Information

Product & Sales Information of products subject to notification