2020/10/30 |
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PCN(产品规格变更通知)
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Change of Wafer Production sites for CIPOS™ Micro Products IM231 |
2021/08/16 |
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PCN(产品规格变更通知)
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Old : MBB (moisture barrier bag) New : ESD shield bag |
2022/01/01 |
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PCN(产品规格变更通知)
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Introduction of BEOL process loop needed for products with Gen5/5.2 gate drivers Description BEOL process Old: Wafer Fab Ltd. (NWF Ltd.), Newport, United Kingdom New: Infineon Technologies Dresden GmbH, Dresden, Germany |
2022/01/01 |
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PCN(产品规格变更通知)
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Business continuity endangered: Introduction of BEOL process loop needed for products with Gen5/5.2 gate drivers for all wafer starts from October 2021 onwards.
Time schedule Intended start of delivery From January 2022 onwards to ensure business continuity. Existing stock will be depleted first. |
2022/09/14 |
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PDN(产品停产通知)
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Phase-out old generation products, replacement with new generation products to reduce complexity |
2023/02/10 |
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PCN(产品规格变更通知)
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Standardization of lot number format. Harmonize and standardize the lot number format across all external production partners Intended start of delivery:2023-02-10 |
2023/02/10 |
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PCN(产品规格变更通知)
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New lot number is visible on product labels. Intended start of delivery:2023-02-10 |