2021/08/15 |
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PCN(Product Change Notice)
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Harmonize and standardize the lot number format across all external production partners Old : Multiple lot number formats New : Standardized into a single 11 alphanumeric lot number format |
2021/11/15 |
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PCN(Product Change Notice)
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Removal of legacy International Rectified (IR) logo from tube and packing box affecting products from assembly location Rectificadores Internacionales, S.A. de C.V., Tijuana , Mexico. Reason: Standardization of packing material across Infineon sites
Description Old: Outer packing box and plastic tube with legacy IR logo New: Legacy IR logo removed from packing box and plastic tube |
2021/12/30 |
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PCN(Product Change Notice)
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ROCESS - ASSEMBLY: Change of lead frame finishing material / area (internal) PROCESS - ASSEMBLY: Change of lead and heat slug plating material/plating thickness (external) PROCESS - ASSEMBLY: Change of mold compound / encapsulation material PROCESS - ASSEMBLY: Change of product marking PROCESS - ASSEMBLY: Move all or parts of production to a different assembly site. TEST FLOW: Move of all or part of electrical wafer test and/or final test to a different test site |
2022/09/15 |
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PCN(Product Change Notice)
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Change of parts of wafer production from Xintec Inc., Taiwan to Vanguard International Semiconductor Corporation, Taiwan and additional assembly site for D2Pak,Dpak,TO220 Mosfets.
Time schedule Intended start of delivery : 2022-09-15 |
2023/08/29 |
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PDN(Product Discontinuation Notice)
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Reason: Product portfolio rationalization |