2021/06/30 |
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PCN(Product Change Notice)
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Several changes for Gen 7N MOSFETs affecting D2PAK, DPAK and TO220 packages : Old New PROCESS - WAFER PRODUCTION: (specifically chip backside) Cr/Ni/Ag Sputter Ti/Ni/Ag Evap PROCESS - WAFER PRODUCTION: (specifically chip frontside) Al/Si Al/Si/Cu PROCESS - WAFER PRODUCTION: wafer fab Infineon Technologies EPISIL Taiwan Americas Corp., Temecula, United States |
2021/08/15 |
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PCN(Product Change Notice)
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Harmonize and standardize the lot number format across all external production partners Old : Multiple lot number formats New : Standardized into a single 11 alphanumeric lot number format |
2021/11/15 |
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PCN(Product Change Notice)
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Removal of legacy International Rectified (IR) logo from tube and packing box affecting products from assembly location Rectificadores Internacionales, S.A. de C.V., Tijuana , Mexico. Reason: Standardization of packing material across Infineon sites
Description Old: Outer packing box and plastic tube with legacy IR logo New: Legacy IR logo removed from packing box and plastic tube |
2022/11/07 |
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PDN(Product Discontinuation Notice)
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Product discontinuation |
2022/11/07 |
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PDN(Product Discontinuation Notice)
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Product discontinuation - updated information |