2021/03/01 |
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PCN(Product Change Notice)
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WAFER PRODUCTION: metallization (specifically chip frontside / backside) ASSEMBLY:Move of all or part of assembly to a different location/site/subcontractor TEST FLOW:Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor |
2021/04/22 |
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PCN(Product Change Notice)
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Early PCN: Several changes affecting Gen 5P mosfets for DSO8 package : Old New WAFER metallization (chip backside) Cr/Ni/Ag Sputter Process Ti/Ni/Ag Evaporation Process WAFER metallization (chip frontside) Al/Si Al/Si/Cu WAFER fab Infineon Technologies EPISIL Technologies Inc. Americas Corp., Temecula, United States |
2021/08/15 |
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PCN(Product Change Notice)
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Harmonize and standardize the lot number format across all external production partners Old : Multiple lot number formats New : Standardized into a single 11 alphanumeric lot number format |
2022/08/19 |
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PCN(Product Change Notice)
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Standardization of lot number format Old: Multiple lot number formats New: Standardized into a single 11 alphanumeric lot number format Intended start of delivery : 2022-08-19
Note: Customers may receive both current and new lot number formats, in same packing material, as all existing inventory cannot be re-labeled |
2023/03/01 |
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PDN(Product Discontinuation Notice)
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Infineon Technologies AG Product Discontinuation |