2021/12/24 |
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PCN(Product Change Notice)
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Device Label correction/change for select Devices |
2023/02/27 |
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PCN(Product Change Notice)
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Add Cu as Alternative Wire Base Metal for Selected Device(s) Customer Contact: Proposed 1st Ship Date: May 25, 2023 |
2023/04/14 |
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PCN(Product Change Notice)
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Add Cu as Alternative Wire Base Metal for Selected Device(s) Revision D is to update the Qualification report for PDIP devices.
Proposed 1st Ship Date: May 25, 2023 |
2023/05/15 |
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PCN(Product Change Notice)
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Add Cu as Alternative Wire Base Metal for Selected Device(s) Proposed 1st Ship Date: May 25, 2023 Revision C is to remove devices in the Product Affected Section (in BOLD charactor) |
2023/05/25 |
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PCN(Product Change Notice)
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Add Cu as Alternative Wire Base Metal for Selected |
2023/05/25 |
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PCN(Product Change Notice)
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Add Cu as Alternative Wire Base Metal for Selected Device(s) This revision A is to remove devices that are included on PCN20230125001.2. |
2025/05/13 |
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PCN(Product Change Notice)
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Supplier Notice No.:20250212004.1 Title: Qualification of RFAB using qualified Process Technology, Die Revision, Datasheet and additional Assembly Site/BOM options for select devices
Description of Change: Texas Instruments is pleased to announce the addition of RFAB using the TIB qualified process technology and additional Assembly Site/BOM options for the devices listed below.
Reason for Change: These changes are part of our multiyear plan to transition products from our 150-millimeter factories to newer, more efficient manufacturing processes and technologies, underscoring our commitment to product longevity and supply continuity.
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive /negative): None
Proposed 1st Ship Date: May 13, 2025 |