2024/04/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:HDL2-0371 Title: Supplier addition of mold resin for LQFP products in RH850 and RL78 Series.
Description of Change: Renesas will add a mold-resin supplier for LQFP products in RH850/F1, D1, P1, E1, C1, R1 and RL78/F1,D1A Series as follows: Mold Resin: Supplier Addition Before Change/Supplier A After Change/Supplier A and Supplier B
Reason for Change: For countermeasures against an issue in which there is possibility of supply shortage due to the current mold-resin supplier at the present moment, and moreover, to realize stable product supply by adding mold-resin suppliers for the future.
Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date: 4/1/2024 |
2025/06/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:HPLM-2024-0019 Title: Supplier addition of Cu-wire for LQFP products in RH850/F1, R1 and D1 Series
Description of Change: Renesas will add a Cu-wire supplier for LQFP products in RH850/F1, R1 and D1 Series as follows: Item / Before Change / After Change Cu-wire: Supplier Addition / Supplier A / Supplier A and Supplier B
Reason for Change: For stable product supply by adding Cu-wire suppliers.
Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date: 6/1/2025 |
2025/06/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:HPLM-2024-0040 Title: Supplier addition of Cu-wire for LQFP products in RH850/F1, R1 and D1 Series
Description of Change: Renesas will add a Cu-wire supplier for LQFP products in RH850/F1, R1 and D1 Series as follows: Item / Before Change / After Change Cu-wire: Supplier Addition / Supplier A / Supplier A and Supplier B
Applicable Assembly Factory Renesas Electronics Corporation Nishiki Factory Renesas Semiconductor (Suzhou) Co., Ltd.
Reason for Change: For stable product supply by adding Cu-wire suppliers.
Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date: 6/1/2025 |
2025/09/01 |
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PCN(Product Change Notice)
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Renesas plans to add the production sites for RH850/F1KM-S1 Series. |
2025/09/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:HPLM-2025-0083 Title: Addition of production sites and material changes for RH850/F1KM-S1 Series
Description of Change: Renesas plans to add the following production sites for RH850/F1KM-S1 Series. 1.Wafer Process (WP) and Wafer Test (WT): Naka Factory For both Suzhou Factory and Nishiki Factory,φ20umCu-wire and mold resin for φ20um Cu-wire will be used for Assembly Process of products whose Wafer Process is produced at Naka (There are no material changes in ATJ-Kumamoto). 2.Back Grind (BG) and Dicing (DIC): Oita Factory 3.Assembly and Final Test (FT): Nishiki Factory
Reason for Change: For the stable supply of products.
Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date: 9/1/2025 |