2024/09/30 |
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PDN(Product Discontinuation Notice)
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Supplier Notice No.:PDN-00001 Title: Discontinuance of Select MOSFET Bare Die Products, Discrete Power Devices, and Power Modules
Product Discontinuance Notification Details: Wolfspeed is announcing the discontinuance of select Power Die Products, Discrete Power Devices and Power Modules. The reason for the obsolescence of these products is the shift of Wolfspeed’s die and device fabrication from the North Carolina Fabrication (NCF) facility to the Mohawk Valley Fabrication (MVF) facility. |
2024/10/18 |
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PCN(Product Change Notice)
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Wolfspeed is shifting its die and device fabrication from Noth Carolina Fabrication (NCF) to Wolfspeed’s stateof-the-art 200-mm wafer Mohawk Valley Fabrication (MVF) facility in New York. |
2025/01/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCN-00129 Title: Manufacturing of Power Modules on 200-mm Wafers at the Mohawk Valley Fabrication (MVF) Facility
Description of the Change Wolfspeed’s silicon carbide (SiC) power modules are currently manufactured on 150-mm wafers at Wolfspeed’s fabrication facilities in Durham, North Carolina, USA (NCF). To increase its production capacity, Wolfspeed will utilize its state-of-the art 200-mm wafer Mohawk Valley Fabrication (MVF) facility in New York, USA.
Anticipated Impact There is no impact to form, fit, and/or function due to equipment upgraded for 200-mm MVF wafers.
(Projected) First Ship Date: January 2025 |
2025/03/17 |
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PCN(Product Change Notice)
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UL Certification of BM2 and BM3 Power Modules |