Enables Layout without Multi-Layer PCB for Cost Saving

 

June 14, 2013

 

TOKYO - Toshiba Corporation (TOKYO: 6502) today announced that it has expanded its package line-up of interface-converter bridge LSIs for high resolution LCD display that are used in tablet PC, Ultrabooks™ and other applications. Mass production of "TC358778XBG" is scheduled to start in June, followed by "TC358777XBG" in July.

 

The ball pitch of the original product is 0.4mm, and fine pitch assembly equipment is required for production. Expanding the ball pitch from 0.4mm to 0.65mm achieves assembly with no need for such equipment. Toshiba has also optimized the pin assignment for layout without high cost PCB with more than 4 layers.

 

Those new package products reduce the set makers' cost of assembly and materials.

 

 

Key Features

■Ball pitch expanded from 0.4mm to 0.65mm
■Optimized pin assignment allows layout with no need for high cost PCB with more than 4 layers

 

 *: Ultrabook™ is a trademark of Intel Corporation in the US and/or other countries.

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

 

 

Toshiba Corporation- Semiconductor and Storage Products Company　Website＞
http://www.semicon.toshiba.co.jp/eng/index.html?mm=cp0614&no=02

 

 

Visit Chip1Stop Chinese site
Visit Chip1Stop Korean site
Visit Chip1Stop English site
Visit Chip1Stop German site

企业HP：
http://www.semicon.toshiba.co.jp/eng/index.html?mm=cp0614&no=02

Toshiba新闻发布

• Toshiba Releases Gate Driver IC for Automotive Brushed DC Motors that Will Contribute to Downsizing of Equipment

  2025/03/14Toshiba  汽车

• Toshiba Releases SiC MOSFET Gate Driver Photocoupler with Enhanced Safety Functions for Industrial Equipment

  2025/03/07Toshiba  电源/电力

• Toshiba Releases Automotive Standard Digital Isolators Compliant with AEC-Q100

  2025/02/28Toshiba  汽车

• Toshiba Releases Small Photorelays with High Speed Turn-On Time that Help Shorten Test Time for Semiconductor Testers

  2025/02/21Toshiba  测量/试验

• Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters

  2024/11/13Toshiba  汽车

相关新闻

• Toshiba Launches 30V N-Channel Common-Drain MOSFET Suitable for Devices with USB and for Protecting Battery Packs

  2023/11/08  Toshiba  模拟

• Toshiba Launches Small Photorelay Suitable for High-Frequency Signal Switches in Semiconductor Testers

  2023/10/18  Toshiba  模拟

• Toshiba Develops Industry’s First 2200V Dual Silicon Carbide (SiC) MOSFET Module That Contributes to High Efficiency and Downsizing of Industrial Equipment

  2023/08/30  Toshiba  模拟

• Toshiba Launches High Voltage, Low Current Consumption LDO Regulators that Help to Lower Equipment Stand-By Power

  2023/05/24  Toshiba  模拟

• Toshiba Announces Thermoflagger™, a Simple Solution that Detects Temperature Rises in Electronic Equipment

  2023/05/17  Toshiba  模拟