Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
2016/02/24Toshiba
IoT
-Supports communications by low-profile Bluetooth Smart applications in a very thin chip-scale package-
February 23, 2016
TOKYO– Toshiba Corporation's (TOKYO: 6502) Semiconductor & Storage Products Company today announced the launch of “TC3567WBG-006”, a new line-up of Bluetooth® Low Energy[1] (LE) communication ICs that support Bluetooth Core Version 4.1 for use with Scatternet[2] devices. Sample shipments start today.
Based on Toshiba’s already released “TC35667FTG/FSG-005” for Bluetooth Smart devices, the new IC is configured with new ROM software for Scatternet and multipoint connection, in a very thin chip-scale package, only 2.88mm x 3.04mm x 0.3mm. It will bring Bluetooth Low Energy communication networks to low-profile applications, such as contactless cards, tags and tickets.
The Scatternet standard defines two functions in the Bluetooth Core specification, for Version 4.0 and higher. Compliant devices have to support either multiple or simultaneous connections with Master and Slave devices or multiple connections between two or more Master devices at the same time. Toshiba’s new IC supports both functions with Bluetooth Low Energy, making it easy to create a network with very small devices.
Samples of packaged chips for Scatternet, “TC35667FTG-006/FSG-006”, and of “TC35670FTG-006”, which supports both Bluetooth and NFC tag functionality, also start to ship today.
Toshiba will contribute to the realization and promotion of Scatternet-based communication networks with low-profile applications, and support devices that optimize communication functions required for Internet of Things (IoT) applications, such as auto-monitoring systems and multifunctional applications.
Key Features of the New Product
■Low power consumption:
Less than 5.9mA at peak current consumption of Bluetooth communication (@3.3V, -4dBm transmitter output power or receiver operation)
50nA typical current consumption in deep sleep (@3.3V)
■Receiver sensitivity:-92.5dBm
■Supports Bluetooth Low Energy central and peripheral devices
■Supports servers and client functions defined by GATT (Generic Attribute Profile)
Applications
Bluetooth Smart devices, including connected home products, wearable devices, healthcare devices, smartphone accessories, remote controllers, toys and IoT devices.
Main Specifications
1.Bluetooth Low Energy: the low power consumption communication technology defined as Bluetooth Ver. 4.0 and higher.
2.Scatternet: A group of independent and non-synchronized piconets (a piconet is formed when at least two Bluetooth-enabled devices connect) that share at least one common Bluetooth device.
* Bluetooth, Bluetooth Low Energy and Bluetooth Smart Ready are registered trademarks owned by the Bluetooth SIG; Toshiba uses them under license.
For more information about the new product, please visit:
http://toshiba.semicon-storage.com/info/lookup.jsp?pid=TC35667WBG-006®ion=apc&lang=en?mm=cp160224&no=15
*Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
Toshiba Corporation- Semiconductor and Storage Products Company Website＞http://toshiba.semicon-storage.com/ap-en?mm=cp160224&no=16
Visit Chip1Stop Chinese site
Visit Chip1Stop Korean site
Visit Chip1Stop English site
Visit Chip1Stop German site
企业HP：
http://toshiba.semicon-storage.com/ap-en?mm=cp160224&no=16
相关新闻
-
-
-
-
-
