| 2024/04/01 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:HDL2-0371
Title:
Supplier addition of mold resin for LQFP products in RH850 and RL78 Series.
Description of Change:
Renesas will add a mold-resin supplier for LQFP products in RH850/F1, D1, P1, E1, C1, R1 and RL78/F1,D1A Series as follows:
Mold Resin: Supplier Addition
Before Change/Supplier A
After Change/Supplier A and Supplier B
Reason for Change:
For countermeasures against an issue in which there is possibility of supply shortage due to the current mold-resin supplier at the present moment, and moreover, to realize stable product supply by adding mold-resin suppliers for the future.
Impact on Fit, Form, Function, Quality & Reliability:
The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date:
4/1/2024 |
| 2025/06/01 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:HPLM-2024-0019
Title:
Supplier addition of Cu-wire for LQFP products in RH850/F1, R1 and D1 Series
Description of Change:
Renesas will add a Cu-wire supplier for LQFP products in RH850/F1, R1 and D1 Series as follows:
Item / Before Change / After Change
Cu-wire: Supplier Addition / Supplier A / Supplier A and Supplier B
Reason for Change:
For stable product supply by adding Cu-wire suppliers.
Impact on Fit, Form, Function, Quality & Reliability:
The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date:
6/1/2025 |
| 2025/06/01 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:HPLM-2024-0040
Title:
Supplier addition of Cu-wire for LQFP products in RH850/F1, R1 and D1 Series
Description of Change:
Renesas will add a Cu-wire supplier for LQFP products in RH850/F1, R1 and D1 Series as follows:
Item / Before Change / After Change
Cu-wire: Supplier Addition / Supplier A / Supplier A and Supplier B
Applicable Assembly Factory
Renesas Electronics Corporation Nishiki Factory
Renesas Semiconductor (Suzhou) Co., Ltd.
Reason for Change:
For stable product supply by adding Cu-wire suppliers.
Impact on Fit, Form, Function, Quality & Reliability:
The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date:
6/1/2025 |
| 2025/09/01 |
|
PCN（产品规格变更通知）
|
Renesas plans to add the production sites for RH850/F1KM-S1 Series. |
| 2025/09/01 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:HPLM-2025-0083
Title:
Addition of production sites and material changes for RH850/F1KM-S1 Series
Description of Change:
Renesas plans to add the following production sites for RH850/F1KM-S1 Series.
1.Wafer Process (WP) and Wafer Test (WT): Naka Factory
For both Suzhou Factory and Nishiki Factory,φ20umCu-wire and mold resin for φ20um Cu-wire will
be used for Assembly Process of products whose Wafer Process is produced at Naka (There are no
material changes in ATJ-Kumamoto).
2.Back Grind (BG) and Dicing (DIC): Oita Factory
3.Assembly and Final Test (FT): Nishiki Factory
Reason for Change:
For the stable supply of products.
Impact on Fit, Form, Function, Quality & Reliability:
The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date:
9/1/2025 |
