2025/07/20 |
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PCN(产品规格变更通知)
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Supplier Notice No.:PCN 25_0119 Rev. - Title:Bond Wire Change from Gold to Copper (Automotive)
Description Of Change: Change of bond wire from Gold to Copper for LFCSP/SO/TSSOP pkg family built in UTAC (Thailand).
Reason For Change: The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives.
Impact of the change (positive or negative) on fit, form, function & reliability: This change has no impact on fit, form, function & reliability.
Effectivity Date: 20-Jul-2025 (the earliest date that a customer could expect to receive changed material) |