| 2020/12/16 |
|
PCN（产品规格变更通知）
|
NXP Will Add a Sealed Date to the Product Label
* Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same.
PP0000724692/93/94/95/96/98 |
| 2021/05/28 |
|
PCN（产品规格变更通知）
|
NXP Final Test Site Relocation Initiative: ATTJ to ATTJ Building 2 (ATTJ-B2) - Phase 2 Qualification Results |
| 2023/05/27 |
|
PCN（产品规格变更通知）
|
Linux Kernel GPLv2 License Breach Introduced in Q4’2022 Linux Factory Release LF 5.15.71_2.2.0 has been distributed to customers
Remarks
NXP has released two patches on Feb 9th 2023 on NXP’s GitHub repository “nxp-imx/linux-imx” to fix the problem.
These patches will roll back the license to “GPL v2.0 only” for all affected source files
and make them compliant with Linux kernel licensing scheme.
The patches also remove author’s email ID from the code comments.
The following are the patches accessible by customers on GitHub to remedy the problem.
1. LF-8313-1: Update License to GPL-2.0
2. LF-8313-2: Update License to GPL-2.0
Customers using EVKs for evaluation can download the new images/binaries from the following link
and continue to their evaluation.
https://www.nxp.com/design/software/embedded-software/i-mx-software/embedded-linux-for-i-mx-applications-processors:IMXLINUX |
| 2025/01/01 |
|
PCN（产品规格变更通知）
|
This material change will take place for substrates manufactured by Nanya and ASE supplier. |
| 2025/01/01 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:202409013F01
Title:
i.MX6 SoloLite, i.MX6 SoloX, i.MX6 Solo, i.MX6 DualLite Automotive product Qualification of Material Changes in Substrate and Solder Ball at N
Reason:
Qualification of Material Changes in Substrate and Solder Ball is required for manufacturing flexibility and customer supply assurance.
Identification of Affected Products:
Product identification does not change
Effective Date: Jan 01, 2025
|
| 2025/05/26 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:202504007I
Title:Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products(3/7)
Description:
Previously, NXP Semiconductors announced with General Notification 202502001G (16-Feb-2025) the Freescale logo to NXP logo product marking conversion for all former Freescale products not previously converted.
Now, for customer convenience, NXP Semiconductors provides a follow-up series of Customer Information Notifications (CINs) to relay to customers their impacted products. Note that due to the extensive product list, your organization may indeed receive multiple CIN notifications to encompass your impacted products.
Reason:
This NXP marking initiative achieves unified NXP branding for the entire portfolio.
Customer Information Notification to relay to customers their impacted products.
Anticipated Impact on Form, Fit, Function, Reliability or Quality :
No Impact on form, fit, function, reliability or quality |
