2019/07/03 |
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PCN(製品仕様変更通知書)
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Qualification of TSMC (Taiwan) as additional FE Plant for the listed MEMS 6-AXIS LSM6DSO family. Line transfer for a full process or process brick (process step, control plan, recipes) from one site to another site: Wafer fabrication
[Old] FE Plants: ST Agrate, ST Crolles.
[New] FE Plants: ST Agrate, ST Crolles, TSMC (Taiwan). |
2020/11/30 |
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PCN(製品仕様変更通知書)
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Product / Process Change Notification H9A Capacity Increase for all Consumer MEMS products. |
2021/01/08 |
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PCN(製品仕様変更通知書)
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MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of Change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
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2021/03/01 |
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PCN(製品仕様変更通知書)
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H9A Capacity Increase for all Consumer MEMS products. |
2022/04/24 |
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PCN(製品仕様変更通知書)
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Setup of a 2nd EMEA DC in Frankfurt for closer deliveries to customers in Germany & Eastern Europe. The change also includes personnel, location, logistic model.. |
2022/05/08 |
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PCN(製品仕様変更通知書)
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Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
2022/05/08 |
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PCN(製品仕様変更通知書)
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Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule Intended start of delivery 2022-05-08 |
2022/05/15 |
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PCN(製品仕様変更通知書)
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Notification related for 2nd EMEA DC project in Frankfurt |
2023/05/31 |
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PCN(製品仕様変更通知書)
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NEW 12” WAFERS FAB (AG300) IN AGRATE AVAILABLE FOR PRODUCTION (EARLY NOTIFICATION) Timing / schedule Intended start of delivery : 2023-05-31 |
2023/07/14 |
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PCN(製品仕様変更通知書)
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LSMDSO family: asic diffusion in AG300 (ST Agrate). |
2024/01/09 |
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PCN(製品仕様変更通知書)
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Description of change: Old:Molding Compound: Sumitomo EME-G770HF(Japan Plant) in UTAC. New:Molding Compound: Showa Denko CEL-9740ZHF10-G in UTAC. Intended start of delivery 2024-01-09 |