2020/11/20 |
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PCN(Product Change Notice)
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Early PCN: Several changes affecting Gen 5P mosfets for D2PAK, DPAK, TO220 packages |
2021/08/15 |
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PCN(Product Change Notice)
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Harmonize and standardize the lot number format across all external production partners Old : Multiple lot number formats New : Standardized into a single 11 alphanumeric lot number format |
2021/10/31 |
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PCN(Product Change Notice)
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Early PCN: Several changes affecting Gen 5P mosfets for D2PAK, DPAK, TO220 packages : Old New WAFER metallization(chip backside) Cr/Ni/Ag Sputter Process Ti/Ni/Ag Evaporation Process WAFER metallization(chip frontside) Al/Si Al/Si/Cu wafer fab Infineon Technologies Americas Corp., EPISIL Technologies Inc. Temecula, United States ASSEMBLY:leadframe dimensions Dpak part AUIRFR5410TRL only: Dpak part AUIRFR5410TRL only: Single gage leadframe Dual gage leadframe ASSEMBLY:lead frame finishing TO220 and Dpak are affected only: TFME Only Ni plated in all area TO220 and Dpak: Bare Cu Cu on die pad in all area etc, |
2021/10/31 |
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PCN(Product Change Notice)
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Several changes affecting Gen 5P Mosfets for D2PAK, DPAK, TO220 packages |
2021/11/15 |
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PCN(Product Change Notice)
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Removal of legacy International Rectified (IR) logo from tube and packing box affecting products from assembly location Rectificadores Internacionales, S.A. de C.V., Tijuana , Mexico. Reason: Standardization of packing material across Infineon sites
Description Old: Outer packing box and plastic tube with legacy IR logo New: Legacy IR logo removed from packing box and plastic tube |
2022/10/01 |
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PCN(Product Change Notice)
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Introduction of an additional assembly location TFME, China for Gen5P D2PAK MOSFET Time schedule Intended start of delivery : 2022-10-01 |
2023/08/29 |
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PDN(Product Discontinuation Notice)
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Reason: Product portfolio rationalization |