2021/09/13 |
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PCN(製品仕様変更通知書)
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Laser Top Mark for 8SOICN Assembled in ADPG, UTL and CRM converting the top mark fromink to laser on ADI (legacy Linear Tech) products in all 8SOICNpackages assembled in ADPG, UTACandCarsem. |
2021/10/07 |
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PCN(製品仕様変更通知書)
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Laser Top Mark for 8SOICN Assembled in ADPG, UTL and CRM As part of continuous quality improvement program we will be converting the top mark from ink to laser on ADI (legacy Linear Tech) products in all 8SOICN packages assembled in ADPG, UTAC and Carsem.
Publication Date: 05-Jul-2021 |
2022/10/12 |
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PCN(製品仕様変更通知書)
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Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 1 of 2) Effectivity Date: 12-Oct-2022 |
2022/10/12 |
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PCN(製品仕様変更通知書)
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Epoxy formulation change toHenkel 8290AfromHenkel 8290. EffectivityDate: 12-Oct-2022 (the earliest date that a customer could expect to receive changed material) |
2022/11/14 |
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PCN(製品仕様変更通知書)
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Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 1 of 2) Rev. A 14-Nov-2022 14-Nov-2022 Adding additional parts Effectivity Date: 14-Nov-2022 (the earliest date that a customer could expect to receive changed material) |
2025/01/10 |
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PCN(製品仕様変更通知書)
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Revision Description: Initial Release. Description Of Change: Migrating bottom trace code marking to top side package laser mark. Reason For Change: To standardize the marking method with other packages across the company and align with industry environmental initiatives. |
2025/01/10 |
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PCN(製品仕様変更通知書)
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Supplier Notice No.:PCN 24_0236 Rev. - Title: Migrating Bottom Trace Code Marking to Top Side Laser Marking for SOIC_N Package
Description Of Change: Migrating bottom trace code marking to top side package laser mark.
Impact of the change (positive or negative) on fit, form, function & reliability: No impact to form, fit, function or reliability of the device.
Effectivity Date: 10-Jan-2025 (the earliest date that a customer could expect to receive changed material)
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