PCN/PDN/NRND Information S32G399AACK1VUCT｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2024/03/22	PCN(Product Change Notice)	NXP Semiconductors announces an update of the Reference Manual for S32G3 from Revision 3.1 to Revision 4.
2024/07/01	PCN(Product Change Notice)	NXP Semiconductors announces errata update for the following products associated with this notification: 1. S32G2_0P77B from Rev. 3.1, 7/2023 to Rev. 3.2, 3/2024. 2. S32G2_1P77B from Rev. 1.1, 7/2023 to Rev. 1.2, 3/2024. 3. S32G3_1P72B from Rev. 2.2, 7/2023 to Rev. 2.3, 3/2024. 4. S32V234_1N81U from Rev. 1.6, 2/2022 to Rev. 1.7, 2/2024. 5. S32V234_2N81U from Rev. 1.0, 4/2022 to Rev. 1.1, 2/2024. 6. SAC57D54H_0N87P from Rev. 9, 8/2022 to Rev. 10, 3/2024. 7. SAC57D54H_1N87P from Rev. 6, 8/2022 to Rev. 7, 3/2024. 8. MPC5746C_1N84S from Rev. 6, 8/2022 to Rev. 7, 3/2024. 9. MPC5746C_1N06M from Rev. 9, 8/2022 to Rev. 10, 3/2024. 10. MPC5744P_1N15P from Rev Jul2023 to Rev June2024. 11. MPC5744P_1N65H from Rev Jul2023 to Rev June2024. 12. MPC5777M_0N50N from Rev Aug2021 to Rev June2024.
2024/11/01	PCN(Product Change Notice)	Supplier Notice No.:202406007I Title: S32G2 Data Sheet Update from Rev6 to Rev7 and S32G3 Data Sheet Update from Rev2 to Rev3 Description: NXP Semiconductors announces S32G2 maskset 0P77B/1P77B Data Sheet update from Rev6 to Rev7 and S32G3 maskset 1P72B Data Sheet update from Rev2 to Rev3. The revision history (Appendix) included in the updated documents provides detailed description of the changes. Reason: The Data Sheet has been updated to provide additional technical clarification on some device features. Anticipated Impact on Form, Fit, Function, Reliability or Quality: No Impact on form, fit, function, reliability or quality Effective Date: Nov 01, 2024
2024/11/14	PCN(Product Change Notice)	Supplier Notice No.:202410008I Title: S32G2 Mask Set 0P77B/1P77B and S32G3 Mask Set 1P72B Errata Update Description: NXP Semiconductors announces errata update for the S32G2 mask sets 0P77B/1P77B and the S32G3 mask set 1P72B products associated with this notification. S32G2 mask set 0P77B from revision 3.2 to revision 3.3 S32G2 mask set 1P77B from revision 1.2 to revision 1.3 S32G3 mask set 1P72B from revision 2.3 to revision 2.4 Effective Date: Nov 14, 2024
2025/04/08	PCN(Product Change Notice)	NXP Semiconductors announces the Wafer Bump site expansion for the S32G2 (Mask set 1P77B) and S32G3 (Mask set 1P72B) from current TSMC_AP2, Taiwan to ASE-Kaohsiung (ASE-KH), Taiwan wafer bump site.
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