June 24, 2013

 

 

TOKYO- Toshiba Corporation (TOKYO: 6502) today announced that it will showcase its leading-edge semiconductor solutions for mobile devices at Mobile Asia Expo 2013. Toshiba will highlight solutions in five areas: "Smart Connectivity", "Smart Imaging", "Smart Audio", "Memory" and "Discrete", under the unifying concept "A Smart Future Starts from Toshiba Semiconductor Solutions."

Mobile Asia Expo 2013 will run from June 26 to June 28 at Shanghai New International Expo Centre (SNIEC) in Shanghai, China and Toshiba will be at booth N1.F78.

Outline of Toshiba's Exhibition at Mobile Asia Expo 2013:

1.Smart Connectivity: Solutions that use various wireless environments, including near field communication technologies such as TransferJet™ and NFC, plus other technologies, among them FlashAir™, Bluetooth™, Wi-Fi™ and wireless charging.

2. Smart Imaging: System solutions including CMOS sensors and image processing technologies that help to create a safe and smart future.

3.Smart Audio: High quality, low noise, low power audio solutions, including a noise/echo canceller that brings clear communications to a variety of ever-changing user environments, such as audio and movie playback and device control through voice recognition.

4. Memory: High capacity memory products that enable users to store all sorts of data: music, movies, smartphone apps and more. The exhibit will also feature "SeeQVault™", a next-generation content protection technology, which makes it possible to store high definition (HD) contents on memory cards.

5.Discrete: Discrete products in ultra-small packages, such as CSP, which support power management and high-speed interfaces on mobile devices. Products on display will include MOSFETs, load switches and ESD protection diodes.

Notes

*: TransferJet is a trademark licensed by the TransferJet Consortium.
*: FlashAir is a trademark of Toshiba Corporation.
*: SeeQVault is a trademark of NSM Initiatives LLC.
*: Bluetooth is a trademark owned by Bluetooth SIG, Inc. and is used by Toshiba Corporation under license.
*: Wi-Fi is a trademark of Wi-Fi Alliance.

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

Toshiba Corporation- Semiconductor and Storage Products Company　Website＞http://www.semicon.toshiba.co.jp/eng/index.html?mm=cp0624&no=02

 

Visit Chip1Stop Chinese site
Visit Chip1Stop Korean site
Visit Chip1Stop English site
Visit Chip1Stop German site

企业HP：
http://www.semicon.toshiba.co.jp/eng/index.html?mm=cp0624&no=02

Toshiba新闻发布

• Toshiba Releases Gate Driver IC for Automotive Brushed DC Motors that Will Contribute to Downsizing of Equipment

  2025/03/14Toshiba  汽车

• Toshiba Releases SiC MOSFET Gate Driver Photocoupler with Enhanced Safety Functions for Industrial Equipment

  2025/03/07Toshiba  电源/电力

• Toshiba Releases Automotive Standard Digital Isolators Compliant with AEC-Q100

  2025/02/28Toshiba  汽车

• Toshiba Releases Small Photorelays with High Speed Turn-On Time that Help Shorten Test Time for Semiconductor Testers

  2025/02/21Toshiba  测量/试验

• Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters

  2024/11/13Toshiba  汽车

相关新闻

• 轻松集成: RECOM 产品现可在 EPLAN 中使用

  2025/04/30  Recom  企业/市场走向

• 贺！Bourns 再次荣获世纪电源网颁发

  2025/01/06  Bourns  企业/市场走向

• Bourns 荣获 EE Awards Asia 亚洲金选奖年度分立组件大奖

  2025/01/06  Bourns  企业/市场走向

• RECOM 成功收购 LECO，进一步增强了其在高端电源领域内设计和制造方面的专业水平

  2024/09/06  Recom  企业/市场走向

• Bourns 推出具有变革性 EdgMOV™ 压敏电阻系列 提供节省空间的浪涌保护解决方案

  2024/03/18  Bourns  企业/市场走向