LOW PROFILE QFN-PACKAGE POWER MODULE chip one stop

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LOW PROFILE QFN-PACKAGE POWER MODULE

2019/10/10Recom 电源/电力

Gmunden, October 9, 2019 – RECOM’s latest addition to its DC/DC converter portfolio is one of the smallest in its class of low profile QFN--packaged buck regulator power modules. The RPX-2.5 module is exceptional due to its flip-chip technology which increases power density and improves thermal management.

RECOM’s new power module offers a high power density footprint on a 4.5mm x 4mm x 2mm thermally-enhanced QFN package. The RPX-2.5 provides an input range from 4.5 to 28VDC, allowing 5V, 12V or 24V supply voltages to be used. The output voltage can be set with two resistors in the range from 1.2V up to 6V. The maximum output current is 2.5A, and the output is fully protected against continuous short-circuits, output overcurrent, or over-temperature faults. It has an efficiency of up to 91%, and it is thermally optimized due to its flip-chip technology. An integrated shielded inductor in this miniature package makes it optimal for space-constrained applications. To facilitate rapid testing, RECOM also offers an evaluation board for this product so that customers will be able to quickly and easily test. Converter samples, evaluation boards, and OEM pricing are available from all authorized distributors or directly from RECOM.

For more information, please visit www.recom-power.com

Datasheets:
https://recom-power.com/pdf/Innoline/RPX-2.5.pdf

Web image:
https://recom-power.com/media/ProductImage/image800/.f4i6-FyW/ProductImage-377.jpg

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企业HP：
https://recom-power.com/en/index.html?2