| 2020/02/15 |
|
PCN（产品规格变更通知）
|
Converting inner packing carton boxes from ATTJ to ATKL |
| 2020/12/16 |
|
PCN（产品规格变更通知）
|
Quality Notification 202011011I: NXP Will Add a Sealed Date to the Product Label has been distributed to customers |
| 2020/12/16 |
|
PCN（产品规格变更通知）
|
NXP Will Add a Sealed Date to the Product Label
* Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same.
PP0000724692/93/94/95/96/98 |
| 2021/05/21 |
|
PCN（产品规格变更通知）
|
NXP Semiconductors announces the ATTJ Final Test Site Relocation Initiative from the current NXP ATTJ, Tianjin, China test site to local, nearby (2.5km away) ATTJ-B2 test site, creating a consolidated ATTJ Test Center of Excellence. The associated Test Backend Shipping / Packing Operations relocate to the ATTJ-B2 site as well. |
| 2022/01/07 |
|
PCN（产品规格变更通知）
|
This Product Change Notification is to announce the planned qualification of
Daeduck (DDE) substrate supplier for the devices listed in this notification.
The Final PCN is planned to be issued on: Jan 07, 2022. |
| 2022/03/20 |
|
PCN（产品规格变更通知）
|
NXP Semiconductors is announcing the Non-Automotive Qualification of DaeDuck (DDE) substrate supplier
for the i.MX 6Dual/Quad and the i.MX 6DualPlus/QuadPlus family of devices.
Effective date:Mar 20, 2022 |
| 2022/04/27 |
|
PCN（产品规格变更通知）
|
NXP Semiconductors is announcing the Qualification of DaeDuck (DDE) substrate
supplier for the i.MX 6Dual/Quad and the i.MX 6DualPlus/QuadPlus family of devices at NXP-ATKL.
Effective date:Apr 27, 2022 |
| 2022/05/23 |
|
PCN（产品规格变更通知）
|
NXP Semiconductors announces a change to the Country Of Origin listed on the Product Label
for the Republic of Korea.
Beginning the week of May 23, 2022, the NXP Product Label will list the Country Of Origin as SOUTH KOREA.
Reason
To standardize all product packaging label from the Republic of Korea with one Country Of Origin listing. |
| 2023/05/27 |
|
PCN（产品规格变更通知）
|
Linux Kernel GPLv2 License Breach Introduced in Q4’2022 Linux Factory Release LF 5.15.71_2.2.0 has been distributed to customers
Remarks
NXP has released two patches on Feb 9th 2023 on NXP’s GitHub repository “nxp-imx/linux-imx” to fix the problem.
These patches will roll back the license to “GPL v2.0 only” for all affected source files
and make them compliant with Linux kernel licensing scheme.
The patches also remove author’s email ID from the code comments.
The following are the patches accessible by customers on GitHub to remedy the problem.
1. LF-8313-1: Update License to GPL-2.0
2. LF-8313-2: Update License to GPL-2.0
Customers using EVKs for evaluation can download the new images/binaries from the following link
and continue to their evaluation.
https://www.nxp.com/design/software/embedded-software/i-mx-software/embedded-linux-for-i-mx-applications-processors:IMXLINUX |
| 2025/05/26 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:202504007I
Title:Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products(3/7)
Description:
Previously, NXP Semiconductors announced with General Notification 202502001G (16-Feb-2025) the Freescale logo to NXP logo product marking conversion for all former Freescale products not previously converted.
Now, for customer convenience, NXP Semiconductors provides a follow-up series of Customer Information Notifications (CINs) to relay to customers their impacted products. Note that due to the extensive product list, your organization may indeed receive multiple CIN notifications to encompass your impacted products.
Reason:
This NXP marking initiative achieves unified NXP branding for the entire portfolio.
Customer Information Notification to relay to customers their impacted products.
Anticipated Impact on Form, Fit, Function, Reliability or Quality :
No Impact on form, fit, function, reliability or quality |
