| 2020/12/16 |
|
PCN（产品规格变更通知）
|
NXP Will Add a Sealed Date to the Product Label
* Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same.
PP0000724692/93/94/95/96/98 |
| 2021/05/09 |
|
PCN（产品规格变更通知）
|
i.MX RT1015/RT1020/RT1050/RT1060 data sheets update to revision 2,
i.MX RT1024 data sheet update to revision 1 and i.MX RT1064 data sheet update to revision 3.
The revision history included in the updated document provides a detailed description of the changes. |
| 2021/05/21 |
|
PCN（产品规格变更通知）
|
NXP Semiconductors announces the ATTJ Final Test Site Relocation Initiative from the current NXP ATTJ, Tianjin, China test site to local, nearby (2.5km away) ATTJ-B2 test site, creating a consolidated ATTJ Test Center of Excellence. The associated Test Backend Shipping / Packing Operations relocate to the ATTJ-B2 site as well. |
| 2021/11/26 |
|
PCN（产品规格变更通知）
|
NXP Semiconductors announces reference manual update
for i.MXRT1060 to revision 3, for i.MXRT1064 to revision 2 and for i.MXRT1050 to revision 5.
Effective date:Nov 26, 2021 |
| 2021/12/23 |
|
PCN（产品规格变更通知）
|
NXP Semiconductors announces
an errata update to revision 2 for i.MX RT1024,
an errata update to revision 3 for i.MX RT1050,
an errata update to revision 1 for i.MX RT1010,
an errata update to revision 1.3 for i.MX RT1060/RT1064 Silicon A and
an errata update to revision 1.1 for i.MX RT1060/RT1064 Silicon B. |
| 2024/07/12 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:202401002I
Title:
i.MX RT1060 Data Sheet Update to Rev 4
Description:
NXP Semiconductor announces a data sheet update to revision 4 for i.MX RT1060. The revision history included in the updated document provides a detailed description of the changes.
Reason :
The data sheet has been updated to correct errors and add new items.
Anticipated Impact on Form, Fit, Function, Reliability or Quality:
No Impact on form, fit, function, reliability or quality
Effective Date:
Jul 12, 2024 |
| 2025/05/26 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:202504007I
Title:Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products(4/7)
Description:
Previously, NXP Semiconductors announced with General Notification 202502001G (16-Feb-2025) the Freescale logo to NXP logo product marking conversion for all former Freescale products not previously converted.
Now, for customer convenience, NXP Semiconductors provides a follow-up series of Customer Information Notifications (CINs) to relay to customers their impacted products. Note that due to the extensive product list, your organization may indeed receive multiple CIN notifications to encompass your impacted products.
Reason:
This NXP marking initiative achieves unified NXP branding for the entire portfolio.
Customer Information Notification to relay to customers their impacted products.
Anticipated Impact on Form, Fit, Function, Reliability or Quality :
No Impact on form, fit, function, reliability or quality |
