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  2. PCN/PDN/NRND信息

PCN/PDN/NRND信息

PCN（产品/工艺变更通知）和PDN（生产中断通知）信息。

通知日期 通知文书 通知类型 通知信息
2020/09/29 PCN（产品规格变更通知） LSM6DSRTR, LSM6DSRXTR, ISM330DHCXTR: Self-test limits update .
Modification of datasheet :parameters/electrical specification (min./max./typ. values) and/or AC/DC specification

[Old]
Linear acceleration self-test output DS spec min 90 max 1700 mg with Vdd 1.8V
Temperature from -40C to +85C (LSM6DSR LSM6DSRX)
Temperature from -40C to +105C(ISM330DHCX)

[New]
Linear acceleration self test output DS spec min 40 max 1700 mg Vdd 1.8V
Temperature from -40C to +85C (LSM6DSR LSM6DSRX)
Temperature from -40C to +105C(ISM330DHCX)
2020/11/30 PCN（产品规格变更通知） Product / Process Change Notification
H9A Capacity Increase for all Consumer MEMS products.
2021/01/08 PCN（产品规格变更通知） MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of Change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2021/03/01 PCN（产品规格变更通知） H9A Capacity Increase for all Consumer MEMS products.
2021/03/11 PCN（产品规格变更通知） Optimization of TEG structures positioning in scribe lines of asic die for ISM330DHCXTR,
LSM6DSRTR, LSM6DSRXTR.
2022/05/08 PCN（产品规格变更通知） Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08
2022/05/08 PCN（产品规格变更通知） Notification related to 2nd EMEA DC project in Frankfurt

Timing / schedule
Intended start of delivery 2022-05-08
2024/01/27 PCN（产品规格变更通知） MBB (Material Barrier Bag) : extend print out warning message on shelf life
2026/05/29 PCN（产品规格变更通知） Supplier Notice No.:CRP/25/15383
Title:(1/4)ST manufacturing reshaping program - Corporate PCI - Early Notification

Description of change:
Old/ST manufacturing landscape
New/Reshaping of ST’s manufacturing footprint by end 2027

Anticipated Impact on form,fit,function, quality, reliability or processability?
Form : no impact
Fit : no impact
Function : no impact
Reliability : no impact
Processability : no impact

Intended start of delivery:
2026-05-29
2026/05/29 PCN（产品规格变更通知） Supplier Notice No.:CRP/25/15383
Title:(1/4)ST manufacturing reshaping program - Corporate PCI - Early Notification

Description of change:
Old/ST manufacturing landscape
New/Reshaping of ST’s manufacturing footprint by end 2027

Anticipated Impact on form,fit,function, quality, reliability or processability?
Form : no impact
Fit : no impact
Function : no impact
Reliability : no impact
Processability : no impact

Intended start of delivery:
2026-05-29
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