2023/06/14 |
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PCN(产品规格变更通知)
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TSSOP Symbolization update for select devices |
2023/06/18 |
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PCN(产品规格变更通知)
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This letter is to inform customers of a device symbolization change for select~devices in the TSSOP packages that will enable enhanced device level~traceability. |
2023/12/25 |
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PCN(产品规格变更通知)
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Texas Instruments is pleased to announce the qualification of DFAB 200mm as an additional wafer fab option for the devices
Proposed 1st Ship Date: Mar 20, 2024 |
2024/03/20 |
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PCN(产品规格变更通知)
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Qualification of DFAB as an additional Fab Site option for select devices Change Notification / Sample Request |
2025/06/09 |
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PCN(产品规格变更通知)
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PCN No.:PCN20250508000.1A Change Desc.:Qualification of additional Assembly sites for select TSSOP devices
Revision A is to add a mount compound & mold compound that were not included on the original PCN notification.
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