March 27, 2014

 

Reduces mounting area by 90%

TOKYO—Toshiba Corporation (TOKYO: 6502) today announced the launch of ultra-small chip scale package white LEDs for lighting applications that can reduce the mounting area by 90% compared to conventional 3.0 × 1.4 mm package products. [1] The new "TL1WK series" will start sample shipment from April.

The new products utilize gallium nitride-on-silicon (GaN-on-Si) process technology and a new process technology that fabricates the elements of a packaged LED on an 8-inch silicon wafer. The LEDs are the industry's smallest in sub-watt class (1/4-1/2W) white LEDs[2], with a package size of just 0.65 × 0.65mm, but they achieve a luminous efficacy of 130lm/W[3] and superior heat dissipation. Using the new white LEDs makes it possible to achieve a narrow beam in small-size lighting equipments and can contribute to innovation in lighting design.

The new white LEDs will be showcased at "Light + Building", a trade fair for lighting and architecture in Frankfurt, Germany from March 30 to April 4.

Applications
Light sources for general lighting, including straight tube lights, light bulbs and ceiling lights

Main Specifications of the New Products

 

Notes:

[1] Toshiba survey.

[2] As of March 27, 2014. Toshiba survey.

[3] During 60mA operation. Toshiba survey.

 

Follow this link for more on white LEDs.

http://www.semicon.toshiba.co.jp/eng/product/opto/led/index.html?mm=cp0327&no=03

 

 

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

 

Toshiba Corporation- Semiconductor and Storage Products Company　Website＞
http://www.semicon.toshiba.co.jp/eng/index.html?mm=cp0327&no=04

 

 

 

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企业HP：
http://www.semicon.toshiba.co.jp/eng/index.html?mm=cp0327&no=04

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