Designers for 8K+ video architecture or multiple display system will be able to simplify physical application form factor The single chipset supports 4K 60Hz resolution with 2-lane V-by-One® US aggregating 8 lanes of V-by-One® HS

 

2018/09/21

 

TOKYO –THine Electronics, Inc. (“THine”), the global leading semiconductor company focusing on high-speed serial interfaces and image signal processing today announces that the world’s first LSI chipset conforming V-by-One® US Standard is working and its samples are available for limited collaborating customers. This chipset transmits 8K data with 687-billion-color depth through 1-meter FFC and proves high resolution displays can be drastically simpler, thinner and stylisher with designing flexibility and manufacturing yield advantages by applying V-by-One® US technology. Typically, 8K TVs with this technology can use the same number of cables for internal interface as 4K.

 

Please be refered below News Release.

https://www.thine.co.jp/en/news_details/id=1290

企业HP：
http://www.thine.co.jp/en/

THine Electronics新闻发布

• THine Introduces MIPI CSI-2 4Gbps/lane SerDes Chipset

  2019/10/09THine Electronics  模拟

• THine’s Cumulative V-by-One® Shipments over 100 Million Units

  2019/10/09THine Electronics  企业/市场走向

• THine and Keyssa launch a Detachable HD Camera System Solution

  2019/10/09THine Electronics  企业/市场走向

• 直接连接车载摄像机用图像传感器的 V-by-One® HS 新产品样品出货的发表

  2016/12/12THine Electronics  模拟

• THine introduces high performance HD video interface solution for industrial, machine vision, surveillance, and automotive applications

  2016/12/12THine Electronics  模拟

相关新闻

• 轻松集成: RECOM 产品现可在 EPLAN 中使用

  2025/04/30  Recom  企业/市场走向

• 贺！Bourns 再次荣获世纪电源网颁发

  2025/01/06  Bourns  企业/市场走向

• Bourns 荣获 EE Awards Asia 亚洲金选奖年度分立组件大奖

  2025/01/06  Bourns  企业/市场走向

• RECOM 成功收购 LECO，进一步增强了其在高端电源领域内设计和制造方面的专业水平

  2024/09/06  Recom  企业/市场走向

• Bourns 推出具有变革性 EdgMOV™ 压敏电阻系列 提供节省空间的浪涌保护解决方案

  2024/03/18  Bourns  企业/市场走向