Commercialization Alliance and sheet-type development of VSI metamaterial heat dissipation sheet
2021/08/03Nichicon
控制零部件机器
Realization of world’s first revolutionary new heat dissipation sheet
June 22, 2021
Okitsumo Incorporated (Okitsumo), NICHICON CORPORATION (“NICHCON”) and KISCO Ltd.(“KISCO”) have pooled their technological resources and formed a new operational alliance for the commercialization of “VSI*,” an aluminum metamaterial heat dissipation sheet. Okitsumo has been working for many years on research and development of this revolutionary heat dissipation solution. VSI is rewriting the conventional wisdom on heat solutions. By selectively radiating the infrared wavelength emitted by a device’s heat source, it enables heat to pass through the device’s resin housing to be released externally. (VSI is a registered trademark of Okitsumo.
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企业HP:
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