2021/08/15 |
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PCN(製品仕様変更通知書)
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Harmonize and standardize the lot number format across all external production partners Old : Multiple lot number formats New : Standardized into a single 11 alphanumeric lot number format |
2021/11/15 |
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PCN(製品仕様変更通知書)
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Removal of legacy International Rectified (IR) logo from tube and packing box affecting products from assembly location Rectificadores Internacionales, S.A. de C.V., Tijuana , Mexico. Reason: Standardization of packing material across Infineon sites
Description Old: Outer packing box and plastic tube with legacy IR logo New: Legacy IR logo removed from packing box and plastic tube |
2022/09/15 |
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PCN(製品仕様変更通知書)
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Change of parts of wafer production from Xintec Inc., Taiwan to Vanguard International Semiconductor Corporation, Taiwan and additional assembly site for D2Pak,Dpak,TO220 Mosfets.
Time schedule Intended start of delivery : 2022-09-15 |
2024/06/19 |
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PCN(製品仕様変更通知書)
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Supplier Notice No.:INF_024_24 Title: Moisture Barrier Bag and Anti-Static shielding bag elimination for MSL1 devices at Tijuana, Mexico.
Reason: Standardization of packing material for MSL1 devices at Tijuana, Mexico.
Description: Packing material & method:Old/ ◼ Moisture Barrier Bag +Humidity Indicator Card +Desiccant + Dry Pack and ◼ Anti-Static shielding bag + Dry Pack
Packing material & method:New/ ◼ Reel in packing box without Dry Pack
Impact of change: No impact on electrical performance as the change belongs to the standardization of packing material and method for MSL1 devices.
Intended start of delivery: 2024-06-19 |