2022/07/09 |
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PCN(製品仕様変更通知書)
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Laser Top Mark for ETSSOP and TSSOP Packages Assembled in ADPG [PNG] and UTL Effectivity Date: 09-Jul-2022 |
2025/05/19 |
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PCN(製品仕様変更通知書)
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Supplier Notice No.:PCN 25_0016 (Rev -) Title: Bond Wire Change from Gold to Copper Wire (Notification Only)
Description Of Change: Change of bond wire from Gold to Copper wire for LFCSP/SO/TSSOP/TSOT/SC70 pkg family built in UTAC (Thailand). LFCSP BOM will be changed from Sumitomo G770HCD/ Albestik8200 to Sumitomo G700/Ablestik8600. TSSOP Die attach will be changed from Ablestik8200 to Atrox 558. All materials have qualified and in production for ADI devices.
Reason For Change: The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives.
Impact of the change (positive or negative) on fit, form, function & reliability: This change has no impact on fit, form, function & reliability.
Effectivity Date: 19-May-2025 (the earliest date that a customer could expect to receive changed material) |
2025/05/19 |
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PCN(製品仕様変更通知書)
|
Supplier Notice No.:PCN 25_0016 Rev. - Title: Bond Wire Change from Gold to Copper Wire (Notification Only)
Description Of Change: Change of bond wire from Gold to Copper wire for LFCSP/SO/TSSOP/TSOT/SC70 pkg family built in UTAC (Thailand). LFCSP BOM will be changed from Sumitomo G770HCD/ Albestik8200 to Sumitomo G700/Ablestik8600. TSSOP Die attach will be changed from Ablestik8200 to Atrox 558. All materials have qualified and in production for ADI devices.
Reason For Change: The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives.
Impact of the change (positive or negative) on fit, form, function & reliability: This change has no impact on fit, form, function & reliability.
Effectivity Date: 19-May-2025 (the earliest date that a customer could expect to receive changed material) |