2023/12/28 |
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PCN(产品规格变更通知)
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Description of Change: Texas Instruments is pleased to announce the addition of CFAB as an additional Wafer Fab site
Proposed 1st Ship Date: Mar 27, 2024 |
2024/01/09 |
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PCN(产品规格变更通知)
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Description of Change: Revision A is to correct the CFAB wafer diameter to 200mm as highlighted below. Current Fab Site DP1DM5 Process LBC5 Wafer Diameter 200mm
New Fab Site CFAB Process LBC5 Wafer Diameter 200mm
Proposed 1st Ship Date: Mar 27, 2024 |
2024/01/09 |
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PCN(产品规格变更通知)
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The datasheet number will be changing. SN74AVC8T245 SCES517J >> SCES517K SN74AVCH8T245 SCES565H >> SCES565I |
2024/01/14 |
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PCN(产品规格变更通知)
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Updated document, Reason of update: Revision A is to correct the CFAB wafer~diameter from 300mm to 200mm, Qualification of CFAB as an additional Fab site~option for select LBC5 devices. |