2023/04/22 |
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PCN(产品规格变更通知)
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Package Assembly - Key Component Changes. |
2024/01/12 |
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PCN(产品规格变更通知)
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Updated document, Reason of update: Retraction: This document supersedes the~original PCN 34964. |
2024/03/02 |
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PCN(产品规格变更通知)
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Micron is releasing a new firmware revision for eMMC v5.1 TLC (Emerald B). This~revision will improve product quality and reliability. |
2024/04/23 |
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PCN(产品规格变更通知)
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Supplier Notice No.:35347 Title: Micron Inner Box Label
Description: Micron is implementing several alterations to enhance the descriptive quality of the inner box label. These modifications exclusively pertain to the Micron inner box label and will not affect any custom labels. If you encounter this label type, please note the following changes: • Elimination of grid lines. • Revision of the barcode description from "(S) Serial" to "(3S) DN#” (Delivery Note Number). • Slight adjustments to barcode dimensions.
Target timeline for transition: Implementation will begin April 23, 2024.
Reason: Enhancements to Micron label for improved processing.
Anticipated Impact: None. |
2024/05/26 |
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PCN(产品规格变更通知)
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Supplier Notice No.:35316#1 Title: MICRON_v5.1 TLC eMMC (Emerald-B) Non-Auto FW Update
Description: Updated document, Reason of update: This revision updates Description of Change and PCN Type. Micron is releasing a major firmware revision for eMMC v5.1 TLC(Emerald-B). This revision will improve product quality and reliability.
Revision History: REVISION 1, 2024-06-06: This document supersedes the original PCN 35316, dated 2024-02-26. This revision updates Description of Change and PCN Type from below. The FW code and behavior are the same as the original PCN.
Product Ship Date From: 2024-05-26 To: 2024-07-06 PCN Type From: Firmware Change - General To: Firmware Change - Major
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2024/08/10 |
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PCN(产品规格变更通知)
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Supplier Notice No.:35523 Title: MICRON_v5.1 TLC eMMC (Emerald-B) FW Update, Non-Automotive
Description: Micron is releasing a significant firmware revision for eMMC v5.1 TLC (Emerald B) non-auto parts. Customers upgrading to the newly released firmware will receive improvements related to Production State Awareness (PSA), Host Initiated Refresh (HIR), Power Loss Management, RPMB, Thermal Protection, Endurance and significant improvements related to the device initialization, power loss robustness in crosstemperature(X-temp) scenarios, and X-temp Management.
Reason: Product Quality and Reliability
Product Ship Date: 2024-08-10 |
2024/11/18 |
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PCN(产品规格变更通知)
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Micron will be updating all packaging, DDR5 module and LPCAMM2 labels with the~new Micron logo. Any packaging, DDR5 module or LPCAMM2 labels printed after~2024-12-17 will have the new Micron logo. |
2025/06/30 |
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PCN(产品规格变更通知)
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Supplier Notice No.35802 Title:Qualification of 11.5X13 JEDEC Trays from Peak
Description: Micron is qualifying a new supplier for the 11.5X13 tray for the attached list of products. There will be no change to form, fit or function. CURRENT: Tray Supplier: Ubot Pocket Design: Tapered Support Silk Screen: 11.5X13S8X19REVC /152
FUTURE: Tray Supplier: Peak Pocket Design: Tapered Support Silk Screen: 11.5X13S8X19REVD /152
Reason: Supply Flexibility / Security
Product Ship Date: June 30, 2025
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